Guidelines for Grounding and Bonding Telecom Systems
As for the connectors to these busbars, the surface of all bonding and grounding connectors used on a TMGB and TGB shall be of a material that provides an electrochemical potential of less
As for the connectors to these busbars, the surface of all bonding and grounding connectors used on a TMGB and TGB shall be of a material that provides an electrochemical potential of less
Earth ground resistance should be less than 25 ohms unless spec-ified different in this document. Periodic tests should be made at approximately the same time each year to minimize
The grounding resistance of a comprehensive communication building should be less than or equal to one ohm. The grounding resistance of an ordinary communication office should be
A well-designed bonding and grounding system minimizes electrical risks, reduces electromagnetic interference (EMI), and improves system reliability. Below is a comprehensive
PDF version includes complete article with source references. Suitable for printing and offline reading.